SAL38C4HV
Aligner
Environment
Clean room atmosphere
Wafer Size
200~300 mm
Carrying Object
Transparent, translucent, or silicon wafer
Characteristics
Aligner for Multiple Types of Wafers
A prealigner for aligning multiple types of wafers̶regardless of wafer materials such as mirror surface,
transparent or translucent wafer; warped wafer; or non-standard notch or orientation flat.
● Available for silicon wafers with BG tape as well as silicon, transparent,or translucent wafers.
● Available for non-SEMI standard notch or flat.
● Z-axis capable of redo operations is optional.
● Size, shape, material of spindle can be changed according to the wafer type.
● Bernoulli type is also available.
● Full auto-adjustment software JEL ALIGN TOOL comes with the aligner.
● Motor drivers and a controller are built in the aligner.
● Control: RS232C and parallel photo I/O
Standard Specifications
Product Model
SAL38C4HV
Carrying Object
SEMI standard 200 to 300 mm wafer (Transparent, translucent, silicon)
Positioning Time
Centering : 3 sec (Wafer pick-up/placing time excluded)
Positioning Accuracy
Centering: Within ±0.1 mm
Flat locating/Notch locating: Within ±0.1 deg
Sensor
LED light + wafer edge detection with image sensor unit
Wafer Size Change
By command control or switch
Cleanliness
ISO Class 2 (at wafer transfer level when exhausting driving part)
Driving Method
2-phase stepping motor (for 3 axes)
Internal motor driver, controller
Utility
Power: DC24V±10% 3A
Vacuum: -53 kPa or more
Mass
Approx. 10kg
傑億爾股份有限公司
統一編號: 89133741
新竹縣竹北市嘉政九街29號1樓
JEL Automation Co.,Ltd
1F., No. 29, Jiazheng 9th St., Zhubei City, Hsinchu County 302053 , Taiwan (R.O.C.)
TEL: 03-6583741