Product Profile

Product Model: SORTER SYSTEM
Environment: Clean room atmosphere

Wafer Size: 300mm
Carrying Object: Silicon wafer
Product specifications are for reference only, various types of automation equipment and specifications can be designed according to customer needs.
Throughput : 300 wafers/h

Characteristics

• ● Compliance : SEMI Standard (E15.1-0600, E57-0600, E62-0999, E63-0600, E64-0600)

• ● high-throughput（300 wafers/h）

• ● Smooth and high-speed wafer transfer through the planning of the arm's range of motion.

• ● Wafer ID reader is available. (Reading both sides of wafer is an option)

Standard Specifications

Carrier : 300mm FOUP (for 25 wafers)  Compliance: SEMI E47.1, E62

Carrying Object：300mm Silicon wafer (Thickness: 775µm)

Throughput : 300 wafers/h
Cleanliness : ISO Class 2 (when equipped with FFU)

Dimension : W 1250mm x D 2500mm x H 1900mm
Mass : Approx. 800kg

Utility :

● Power: AC200V Single phase ±10% 2kVA
● Dry air: 0.5MPa±10%

● Vacuum: -53kPa or more

#The above specifications are the basic specifications.

Product Profile

Product Model: SORTER SYSTEM
Environment: Clean room atmosphere

Wafer Size: 300mm
Carrying Object: Silicon wafer
Product specifications are for reference only, various types of automation equipment and specifications can be designed according to customer needs.
Throughput : 400 wafers/h

Characteristics

• • ● Compliance : SEMI Standard (E15.1-0600, E57-0600, E62-0999, E63-0600, E64-0600)
  • ● high-throughput（400 wafers/h）
  • ● Smooth and high-speed wafer transfer through the planning of the arm's range of motion.
  • ● Wafer ID reader is available. (Reading both sides of wafer is an option)

Standard Specifications

Carrier : 300mm FOUP (for 25 wafers)   Compliance: SEMI E47.1, E62

Carrying Object : 300mm Silicon wafer   (Thickness: 775 µm)

Throughput : 400 wafers/h

Cleanliness : ISO Class 2 (when equipped with FFU)

Dimension : W 1756mm x D 1200mm x H 1901mm

Mass : Approx. 600kg

Utility :

• Power: AC200V Single phase ±15% 20A
  ● Dry air: 0.7MPa to 0.4MPa
  ● Vacuum: -60kPa or more

#The above specifications are the basic specifications.

Product Profile

Product Model: SORTER SYSTEM
Environment: Clean room atmosphere

Wafer Size: 300mm
Carrying Object: Silicon wafer
Product specifications are for reference only, various types of automation equipment and specifications can be designed according to customer needs.
Throughput : 600 wafers/h

Characteristics

• ● Compliance : SEMI Standard (E15.1-0600, E57-0600, E62-0999, E63-0600, E64-0600)
• ● high-throughput（600 wafers/h）
• ● Smooth and high-speed wafer transfer through the planning of the arm's range of motion.
• ● Wafer ID reader is available. (Reading both sides of wafer is an option)

Standard Specifications

Carrier : 300mm FOUP (for 25 wafers)  Compliance: SEMI E47.1, E62

Carrying Object：300mm Silicon wafer (Thickness: 775µm)

Throughput : 600 wafers/h
Cleanliness : ISO Class 2 (when equipped with FFU)

Dimension : W 1233mm x D 2160mm x H 2000mm

Mass : Approx. 800kg

Utility :

● Power: AC200V Single phase ±15% 15A
● Dry air: 0.7MPa to 0.4MPa
● Vacuum: -60kPa or more

#The above specifications are the basic specifications.

Product Profile

Product Model : SSY-20010
Environment : Clean room atmosphere

Wafer Size: 300mm
Carrying Object : Silicon wafer, spacer (interlayer paper)
Product specifications are for reference only, various types of automation equipment and specifications can be designed according to customer needs.
Applicable Cassette Type : 300 mm container, 300 mm wafer cassette

Characteristics

• ● High accuracy transport of thin wafer in the wafer container.
• ● Automatic wafer transfer between the wafer container and the wafer cassette.
• ● Available for thin wafer as equipped with Bernoulli end-effector.
• ● Automatic identification of wafer and the spacer (interlayer paper).
• ● Automatic identification of the height of wafer.
• ● The number of cassettes and the wafer sizes can be customized.
• ● Automatic lid opening/closing of the wafer container.
• ● Wafer container : made by Achilles Corporation.
• ● Fan filter unit (HEPA) is installed for the cleanliness.
• ● Color sensor allows spacers (interlayer papers) with different colors to be detected easily.
  (Please contact JEL for details.)

Standard Specifications

Applicable Cassette Type: 300 mm wafer container, 300 mm cassette (FOUP)

Carrying Object : 300 mm silicon wafer, 300 mm spacer (interlayer paper)

Cleanliness : Fan filter units is installed.

External Dimensions : W 1350mm x D 1434mm  x H 1900mm

Mass : Approx. 450kg

Utility :

• Power: AC200V±10%
• Clean air: 0.5 MPa 250 NL/min or more
• Vacuum: -70kPa or more

#The above specifications are the basic specifications.

Product Profile

Product Model : SORTER SYSTEM
Environment : Clean room atmosphere

Wafer Size : 150mm
Carrying Object : Glass, Sapphire, GaAs wafer
Product specifications are for reference only, various types of automation equipment and specifications can be designed according to customer needs.
Throughput : 140 wafer/h (Process time excluded)

Characteristics

• ● Access to 4 cassettes is available without a track by the horizontal and multi-joint type robot (GCR4210-500-AM).
• ● 500mm Z-stroke can access the vertically-setting cassettes.
• ● Flip unit of robot can handle wafers without contacting process side.
• ● Mapping sensor is installed to the wrist-block unit.
• ● Open/Close detection sensor is installed to the door and locked during operation.
• ● Aligner (SAL3361GR) for glass wafer is installed.
• ● Communication with users' system can be changed.
• ● Customization is available according to user's needs.

Standard Specifications

Carrying Object : 150mm wafer (Glass, Sapphire, GaAs)

Throughput : 140 wafer/h (Process time in the system is not included)

​

【GCR4210-500-AM】

Operating range : From the robot center to the wafer center.672mm，Rotation Angle(Theta-axis).335deg，Z-axis.500mm，Flip axis.180deg
Carrying Speed (Ave.) : Arm.550mm/sec，Rotation Angle (Theta-axis).300度/sec，Z-axis.300mm/sec
Carrying Speed(Max.) : Arm.900mm/sec，Rotation Angle (Theta-axis).400度/sec，Z-axis.450mm/sec
Carrying Speed(w/o flip unit) : Arm.1800mm/sec，Rotation Angle (Theta-axis).540度/sec，Z-axis.500mm/sec
Repeatability : Within ±0.1mm

【SAL3361GR】

Positioning accuracy : Centering: Within ±0.2mm  Flat locating: Within±0.2deg

Positioning time : Notch search: Within 3 sec (Pick-up/placing time is not included.)

Positioning correction range : Within 4mm radius

【System】

Wafer holding method：By vacuum suction with end-effector
Cleanliness : ISO Class2（ISO14644）
Footprint : 640mm×835mm（Excluding touch panel）
Mass : Approx.350kg
Utility :

● Power：AC200V Single phase 15A 
● Vacuum: -53kPa or more (w/vacuum type end effector)

#The above specifications are the basic specifications.