STCR4130S

4-Axis Cylindrical Coordinate Clean Robot

Features: Designed for handling small wafers in a production line or inspection line of semiconductor.

STCR4130S

ISO Class 2 Clean room atmosphere

200mm / 300mm / 400mm / 450mm / 500mm / 550mm / 600mm

*Design can be modified according to equipment specifications and requirements.

Below 3 kg (Caculated for the 3rd joint)

Designed for handling small wafers in a production line or inspection line of semiconductor.

Arm lineup: 100mm, 130mm, 160mm, 200mm

Twin-arm reduces the wafer swap time.

Base or flange mounting type is selectable.

Motion monitoring is available.

RS232C and parallel photo I/O are standard for control.

2-phase stepping motor installed in all axes.

High-speed, high-accuracy wafer handlingby S-curved speed control.

Wafer holding: end-effector with vacuum suction, passive edge, edge grip type End-effector.

End-effector material: CFRP, Al, ceramic, or others.

Optimal end-effector is selectable according to the carrying object and line layout.

Robot Arm Model	STCR4130S-200-PM
Wrist Block	SART08674
Blade	SC-YW-240
Handled Object	Wafer up to 12 inches
Wafer Holding Method	By vacuum suction
Mechanical Structure	4-axis Cylindrical coordinate type
Motor	Stepping motor
Operating Range	From the robot center to the wafer center: 515mm Rotation angle (θ axis): 340deg Vertical Stroke (Z-axis): 200mm
Carrying Speed(Ave.)	Arm (R-axis): 470mm/sec Rotation (θ axis): 220deg/sec Vertical Stroke (Z-axis): 170mm/sec
Carrying Speed(Max.)	Arm (R-axis): 940mm/sec Rotation (θ axis): 270deg/sec Vertical Stroke (Z-axis): 210mm/sec
Repeatability	Within ±0.1mm
Cleanliness	ISO Class 2 (at wafer transfer level when exhausting driving part)
Utility	Power: DC24V±10% 16A Vacuum: -53kPa or more
Mass	Approx. 30kg (robot arm unit)
Controller Model	C4000 Series
Interface	RS232C and parallel photo I/O

＊Example of standard specifications with JEL standard end-effector (vacuum type)

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