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- SAL38C4HV
JEL Aligner
SAL38C4HV
For Multi Work Wafer Aligner
- Features
- New type of aligner available for any material of wafer for 8 to 12 inches wafer.
Description
Product Model
SAL38C4HV
Environment
Clean room atmosphere
Wafer Size
8 to 12 inches
Characteristics
New type of aligner available for any material of wafer for 8 to 12 inches wafer.
- High-speed, high-accuracy centering and flat/notch locating are available for silicon wafer with BG tape as well as silicon, transparent, or translucent wafer.
- Equipped with JEL-developed image sensor, and internal motor driver and controller.
- Size, shape, material of spindle can be changed according to the wafer type.
- Bernoulli type is also available.
- Control: RS232C and parallel photo I/O.
- Available for non-SEMI standard notch or flat.
- Optional Z-axis for pick-up/place operation is available.
Standard Specifications
| Product Model | SAL38C4HV | |||
|---|---|---|---|---|
| Carrying Object | SEMI standard 8 to 12 inches wafer (Transparent, translucent, silicon) |
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| Positioning Time | Centering : 3 sec (Wafer pick-up/placing time excluded) | |||
| Positioning Accuracy | Centering: Within ±0.1 mm Flat locating/Notch locating: Within ±0.1 deg |
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| Sensor | LED light + wafer edge detection with image sensor unit | |||
| Wafer Size Change | By command control or switch | |||
| Cleanliness | ISO Class 2 (at wafer transfer level when exhausting driving part) | |||
| Driving method | 2-phase stepping motor (for 3 axes) Internal motor driver, controller |
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| Utility | Power: DC24V±10% 3A Vacuum: -53 kPa or more |
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