AC servo motor

MTCR4160

4-Axis Cylindrical Coordinate Clean Robot
Features
Designed for handling 300mm wafers in a production line or inspection line of semiconductor.
High-speed handling by AC servo motor and superior cost performance compared to MTHR type.
Certified CE marking.
Execution of origin search is not required by using the servo motors with absolute encoders.

Description

Model Name

MTCR4160

Environment

ISO Class 2 Clean room atmosphere

Vertical Stroke (Z-axis)

300 mm / 400 mm / 500 mm

*Design can be modified according to equipment specifications and requirements.

Payload Capacity

Below 4 kg (Caculated for the 3rd joint)

Added to Inquiry list.

Characteristics

Designed for handling 12 inches wafers in a production line or inspection line of semiconductor.

High-speed handling by AC servo motor and superior cost performance compared to MTHR type.

Certified CE marking.

Execution of origin search is not required by using the servo motors with absolute encoders.

Arm lineup: 160mm, 200mm
Twin-arm reduces the wafer swap time.
Base or flange mounting type is selectable.
Motion monitoring is available.
RS232C and parallel photo I/O are standard for control.
AC servo motor installed in all axes.
High-speed, high-accuracy wafer handlingby S-curved speed control.
Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector.
End-effector material: CFRP, Al, ceramic, or others.
Optimal end-effector is selectable according to the carrying object and line layout.
 


Standard Specifications

Robot Arm Model MTCR4160-300-AM
Handled Object Wafer up to 12 inches
Wafer Holding Method By vacuum suction
Mechanical Structure 4-axis Cylindrical coordinate type
Motor AC servo motor
Operating Range From the robot center to the wafer center: 575mm
Rotation angle (θ axis): 340 deg
Vertical Stroke (Z-axis): 300mm
Carrying Speed(Ave.) Arm (R-axis): 850mm/sec
Rotation (θ axis): 340deg/sec
Z-axis: 330mm/sec
Carrying Speed(Max.) Arm (R-axis): 1800mm/sec
Rotation (θ axis): 550deg/sec
Z-axis: 500mm/sec
Resolution Arm (R-axis): Below 9.82µm
Rotation (θ axis): 0.0015deg
Z-axis: 1.96µm
Handling level 674.5mm (Base mounting level to end-effector level)
Repeatability Within ±0.1mm
Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part)
Utility Power: AC200V single phase ±10% 3kVA
Vacuum: -53kPa or more
Controller Model C5000S Series
Interface RS232C and parallel photo I/O

*Example of standard specifications with JEL standard end-effector (vacuum type)
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