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Products
High-Tech Manufacturing
AC servo motor
MCR3160C
3-Axis Cylindrical Coordinate Clean Robot
- Features
- Designed for handling 300mm wafers in a production line or inspection line of semiconductor.
- High-speed handling by AC servo motor and superior cost performance compared to MHR type.
- Execution of origin search is not required by using the servo motors with absolute encoders.
Description
Model Name
MCR3160C
Environment
ISO Class 2 Clean room atmosphere
Vertical Stroke (Z-axis)
300 mm / 400 mm / 500 mm
*Design can be modified according to equipment specifications and requirements.
Payload Capacity
Below 4 kg (Caculated for the 3rd joint)
Characteristics
Designed for handling 300mm wafers in a production line or inspection line of semiconductor.
High-speed handling by AC servo motor and superior cost performance compared to MHR type.
Execution of origin search is not required by using the servo motors with absolute encoders.
- Base or flange mounting type is selectable.
- Motion monitoring is available.
- RS232C and parallel photo I/O are standard for control.
- AC servo motors with absolute encoders installed in all axes.
- High-speed, high-accuracy wafer handlingby S-curved speed control.
- Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector.
- End-effector material: CFRP, Al, ceramic, or others.
- Optimal end-effector is selectable according to the carrying object and line layout.
Standard Specifications
| Robot Arm Model | MCR3160C-300-AM | ||
|---|---|---|---|
| Handled Object | Wafer up to 12 inches | ||
| Wafer Holding Method | By vacuum suction | ||
| Mechanical Structure | 3-axis Cylindrical coordinate type | ||
| Motor | AC servo motor | ||
| Operating Range | From the robot center to the wafer center: 567.7mm Rotation angle (θ axis): 340deg Vertical Stroke (Z-axis): 300mm |
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| Carrying Speed(Ave.) | Arm (R-axis): 1000mm/sec Rotation (θ axis): 360deg/sec Vertical Stroke (Z-axis): 350mm/sec |
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| Carrying Speed(Max.) | Arm (R-axis): 1800mm/sec Rotation (θ axis): 580deg/sec Vertical Stroke (Z-axis): 530mm/sec |
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| Resolution | Arm (R-axis): Below 9.82µm Rotation (θ axis): 0.0015deg Vertical Stroke (Z-axis): 1.96µm |
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| Handling level | 639mm (Base mounting level to end-effector level) | ||
| Repeatability | Within ±0.1mm | ||
| Cleanliness | ISO Class 2 (at wafer transfer level when exhausting driving part) | ||
| Utility | Power: AC200V single phase ±10% 3kVA Vacuum: -53kPa or more |
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| Controller Model | C5000S Series | ||
| Communication | RS232C and parallel I/O | ||
＊Example of standard specifications with JEL standard end-effector (vacuum type)
