Stepping motor
SCR3160CS
3-Axis Cylindrical Coordinate Clean Robot
- Features
- Designed for handling small wafers in a production line or inspection line of semiconductor.
Description
Model Name
SCR3160CS
Environment
ISO Class 2 Clean room atmosphere
Operating Range
340 mm (3rd joint center)Vertical Stroke (X-Axis)
200mm / 300mm / 400mm / 450mm / 500mm / 550mm / 600mm
*Design can be modified according to equipment specifications and requirements.
Payload Capacity
Below 3 kg (Caculated for the 3rd joint)
Characteristics
Designed for handling small wafers in a production line or inspection line of semiconductor.
This model is a standard JEL specification and can also be customized according to customer design requirements.
Suitable for wafers up to 300mm and various other flat transfer objects.
- Arm lineup: 100mm, 130mm, 160mm, 200mm
- Base or flange mounting type is selectable.
- Motion monitoring is available.
- RS232C and parallel photo I/O are standard for control.
- 2-phase stepping motor installed in all axes.
- High-speed, high-accuracy wafer handlingby S-curved speed control.
- Wafer holding: end-effector with vacuum suction, passive edge, edge grip type End-effector.
- End-effector material: CFRP, Al, ceramic, or others.
- Optimal end-effector is selectable according to the carrying object and line layout.
Standard Specifications
| Robot Arm Model | SCR3160CS-300-PM | ||
|---|---|---|---|
| Wrist Block | SARS00169 | ||
| Blade | SC-YW-240 | ||
| Handled Object | Wafer up to 12 inches | ||
| Wafer Holding Method | By vacuum suction | ||
| Mechanical Structure | 3-axis Cylindrical coordinate type | ||
| Motor | Stepping motor | ||
| Operating Range | From the robot center to the wafer center: 502.7mm Rotation angle (θ axis): 340deg Vertical Stroke (Z-axis): 300mm |
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| Carrying Speed (Ave.) | Arm (R-axis): 610mm/sec Rotation (θ axis): 340deg/sec Vertical Stroke (Z-axis): 250mm/sec |
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| Carrying Speed(Max.) | Arm (R-axis): 1220mm/sec Rotation (θ axis): 500deg/sec Vertical Stroke (Z-axis): 320mm/sec |
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| Resolution | Arm (R-axis): Below 12.6µm Rotation (θ axis): Below 12.6µm Vertical Stroke (Z-axis): 6.25µm |
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| Repeatability | Within ±0.1mm | ||
| Cleanliness | ISO Class 2 (at wafer transfer level when exhausting driving part) | ||
| Utility | Power: DC24V±10% 15A Vacuum: -53kPa or more |
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| Mass | Approx. 25kg | ||
| Controller Model | C4000 Series | ||
| Interface | RS232C and parallel photo I/O | ||
*Example of standard specifications with JEL standard end-effector (vacuum type)