SCR3100S

3-Axis Cylindrical Coordinate Clean Robot

Features: Designed for handling small wafers in a production line or inspection line of semiconductor.; Minimized footprint compactifies the system layout.

SCR3100S

ISO Class 2 Clean room atmosphere

200 mm / 300 mm / 500 mm

*Design can be modified according to equipment specifications and requirements.

Below 0.5 kg (Caculated for the 3rd joint)

Designed for handling small wafers in a production line or inspection line of semiconductor.

Minimized footprint compactifies the system layout.

Base or flange mounting type is selectable.

Motion monitoring is available.

RS232C and parallel photo I/O are standard for control.

2-phase stepping motor installed in all axes.

High-speed, high-accuracy wafer handlingby S-curved speed control.

Wafer holding: end-effector with vacuum suction, passive edge, edge grip type End-effector.

End-effector material: CFRP, Al, ceramic, or others.

Optimal end-effector is selectable according to the carrying object and line layout.

Robot Arm Model	SCR3100S-200-PM
Handled Object	Up to 6 inches wafer
Wrist Block	SARS00169
Blade	3D-02535
Mechanical Structure	3-axis Cylindrical coordinate type
Motor	Stepping motor
Operating Range	From the robot center to the wafer center: 397.7mm Rotation angle (θ axis): 340deg Vertical Stroke (Z-axis): 200mm
Carrying Speed(Ave.)	Arm (R-axis): 330mm/sec Rotation (θ axis): 280deg/sec Vertical Stroke (Z-axis): 130mm/sec
Carrying Speed(Max.)	Arm (R-axis): 500mm/sec Rotation (θ axis): 480deg/sec Vertical Stroke (Z-axis): 170mm/sec
Repeatability	Within ±0.1mm
Cleanliness	ISO Class 2 (at wafer transfer level when exhausting driving part)
Utility	Power: DC24V±10% 8A Vacuum: -53kPa or more
Controller Model	C4000 series
Interface	RS232C and parallel photo I/O

＊Example of standard specifications with JEL standard end-effector (vacuum type)

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