Stepping motor

STVCR4160

4-Axis Cylindrical Coordinate Clean Robot
Features
Designed for handling wafers in the vacuum chamber of production line and inspection line.
Double payload and superior cost performance compared to STVHR series.
Compatible with STVHR series and it is possible to replace or upgrade into STVCR series.
Execution of origin search is not required by using the servo motors with absolute encoders.

Description

Model Name

STVCR4160

Environment

Magnetic fluid sealing and filter
Vacuum (Temp. 15°C to 50°C)
Driving unit:Clean room atmosphere  (Temp. 15°C to 40°C)

Vertical Stroke (Z-axis)

50 mm

Payload Capacity

Below 2 kg (Caculated for the 3rd joint)

Added to Inquiry list.

Characteristics

Designed for handling wafers in the vacuum chamber of production line and inspection line.

Double payload and superior cost performance compared to STVHR series.

Compatible with STVHR series and it is possible to replace or upgrade into STVCR series.

Execution of origin search is not required by using the servo motors with absolute encoders.

Magnetic fluid sealing is used for arm joint.
Vacuum sealing: Magnetic fluid sealing and bellows are used.
For cleanliness: 5µm mesh filter installed for exhaust ventilation in the arm.
Twin-arm reduces the wafer swap time.
Motion monitoring is available.
RS232C and parallel photo I/O are standard for control.
AC servo motors with absolute encoders installed in all axes.
High-speed, high-accuracy wafer handlingby S-curved speed control.
AC servo motor or 2-phase pulse motor type is selectable.
Wafer holding: end-effector with passive edge or edge grip type End-effector.
End-effector material: CFRP, Al, ceramic, or others.
Optimal end-effector is selectable according to the carrying object and line layout.
 


Standard Specifications

Robot Arm Model STVCR4160-050-AM  
Handled Object Wafer up to 12 inches  
Wafer Holding Method By end-effector with passive edge or edge grip type end-effector  
Mechanical Structure 4-axis Cylindrical coordinate type  
Motor AC servo motor  
Operating Range From the robot center to the wafer center: 600mm
Rotation angle (θ axis): 330deg
Vertical Stroke (Z-axis): 50mm
 
Carrying Speed Arm (R-axis): 520mm/2.0sec
Rotation (θ axis): 330deg/2.7sec
Vertical Stroke (Z-axis): 50mm/1.5sec
 
Resolution Arm (R-axis): Below 4.91µm
Rotation (θ axis): 0.00088deg
Vertical Stroke (Z-axis): 0.488µm
 
Repeatability Within ±0.1mm  
Cleanliness Magnetic fluid sealing and filter  
Vacuum resistance 1.33×10-6Pa  
Utility Power: AC200V single phase ±10% 1kVA  

*Representative specifications of STVCR4160-050-AM.
It can be changed depending on the carrying object and end-effector type.
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