SAL20C1

Edge-grip type Wafer Aligner

Features: Designed for aligning wafers in a production line or inspection line of semiconductor.; Edge grip type aligner minimizes the wafer contact.

SAL20C1

Clean room atmosphere

6 inches

Designed for aligning wafers in a production line or inspection line of semiconductor.

Edge grip type aligner minimizes the wafer contact.

High-speed, high-accuracy centering and notch locating by the edge-grip function.

Designed to reduce the contamination.

RS232C and parallel photo I/O are standard for control.

Product Model	SAL20C1
Carrying Object	JEIDA standard 6 inches silicon wafer
Positioning Time	Orientation flat search: Within 4 sec (Wafer pick-up/placing time excluded)
Positioning Accuracy	Centering: Within ±0.3 mm Orientation flat locating: Within ±0.3 deg
Sensor	Red LED transmissive sensor
Wafer Holding Method	By edge grip
Cleanliness	0.1 µm/cf Class 1 (at wafer transfer level when exhausting driving part)
Driving method	Small size stepping motors at each axis (internal motor driver)
Utility	Power: DC24V±10% 2A

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