GCR4210

4-Axis Horizontal and Multi-Joint Type Clean Robot

Features: Designed for handling 300mm wafers in a production line or inspection line of semiconductor.; Execution of origin search is not required by using the servo motors with absolute encoders.

GCR4210

ISO Class 2 Clean room atmosphere

300 mm / 320 mm / 500 mm

*Design can be modified according to equipment specifications and requirements.

Below 4 kg (Caculated for the 3rd joint)

Designed for handling 12 inches wafers in a production line or inspection line of semiconductor.

Execution of origin search is not required by using the servo motors with absolute encoders.

2 FOUP access is available without a track.

Base or flange mounting type is selectable.

Motion monitoring is available.

AC servo motors with absolute encoders installed in all axes

RS232C and parallel photo I/O are standard for control.

High-speed, high-accuracy wafer handling by S-curved speed control and optimizing pass control.

1.8 times faster compared to GHR4206 type.

End-effector material: CFRP, Al, ceramic, or others.

Optimal end-effector is selectable according to the carrying object and line layout.

Robot Arm Model	GCR4210-300-AM
Handled Object	Up to 12 inches wafers
Wafer Holding Method	By vacuum suction
Mechanical Structure	4-axis horizontal and multi-joint type
Motor	AC servo motor
Operating Range	From the robot center to the wafer center: 760mm Rotation angle (θ axis): 335 degrees Vertical Stroke (Z-axis): 300mm
Transfer Speed	Arm (R-axis): 635mm / 0.8 sec Rotation (θ axis): 335 degrees / sec Vertical Stroke (Z-axis): 300mm / 0.9 sec
Repeatability	Within ±0.1mm
Cleanliness	ISO Class 2 (at wafer transfer level when exhausting driving part)
Facility Requirements	Power: AC200V Single phase ±10% 2kVA Vacuum: -53kPa or more
Weight	Approx. 37kg
Controller Model	C5000S Series
Communication	RS232C and parallel photo I/O

＊Example of standard specifications with JEL standard end-effector (vacuum type)

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