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Products
High-Tech Manufacturing
Horizontal and Multi-Joint Type Clean Robot
GTCR5280
5-Axis Horizontal and Multi-Joint Type Clean Robot
- Features
- A twin end-effector mounted on its single-arm has the same function as a twin-arm robot.
- Designed for handling 12 inches wafers in a production line or inspection line of semiconductor.
- Execution of origin search is not required by using the servo motors with absolute encoders.
Description
Model Name
GTCR5280
Environment
Clean room atmosphere
Vertical Stroke (Z-axis)
300 mm
*Design can be modified according to equipment specifications and requirements.
Payload Capacity
Below 4 kg (Caculated for the 3rd joint)
Characteristics
A twin end-effector mounted on its single-arm has the same function as a twin-arm robot.
Designed for handling 300mm wafers in a production line or inspection line of semiconductor.
Execution of origin search is not required by using the servo motors with absolute encoders.
- 3 FOUP access is available without a track.
- Twin end-effector reduces the wafer swap time.
- Base or flange mounting type is selectable.
- Motion monitoring is available.
- RS232C and parallel photo I/O are standard for control.
- AC servo motors with absolute encoders installed in all axes.
- High-speed, high-accuracy wafer handling by S-curved speed control and optimizing pass control.
- Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector.
- End-effector material: CFRP, Al, ceramic, or others.
- Optimal end-effector is selectable according to the carrying object and line layout.
Standard Specifications
| Robot Arm Model | GTCR5280-300-AM | ||
|---|---|---|---|
| Handled Object | Up to 12 inches silicon wafer | ||
| Wafer Holding Method | By vacuum suction | ||
| Mechanical Structure | 5-axis horizontal and multi-joint type | ||
| Motor | AC servo motor | ||
| Operating Range | From the robot center to the wafer center: 953mm Rotation angle (θ axis): 335 degrees Vertical Stroke (Z-axis): 300mm |
||
| Transfer Speed | Arm (R-axis): 833mm/sec Rotation Angle(θ axis): 250 degr/sec Vertical Stroke (Z-axis): 300mm/sec |
||
| Repeatability | Within ±0.1mm | ||
| Cleanliness | ISO Class 2 (at wafer transfer level when exhausting driving part) | ||
| Facility Requirements | Power: AC200V Single phase ±10% 2kVA Vacuum: -53kPa or more |
||
| Weight | Approx. 50kg | ||
| Controller Model | C5000S Series | ||
| Communication | RS232C and parallel photo I/O | ||
＊Example of standard specifications with JEL standard end-effector (vacuum type)
