GCR4280

4-Axis Horizontal and Multi-Joint Type Clean Robot

Features: Designed for handling 12 inches wafers in a production line or inspection line of semiconductor.; Execution of origin search is not required by using the servo motors with absolute encoders.

GCR4280

ISO Class 2 Clean room atmosphere

300 mm

Below 4 kg (Caculated for the 3rd joint)

Designed for handling 12 inches wafers in a production line or inspection line of semiconductor.

Execution of origin search is not required by using the servo motors with absolute encoders.

3 FOUP access is available without a track.

Base or flange mounting type is selectable.

Motion monitoring is available.

AC servo motors with absolute encoders installed in all axes.

High-speed, high-accuracy wafer handling by S-curved speed control and optimizing pass control.

Wafer holding: end-effector with vacuum suction, passive edge, or edge grip.

End-effector material: CFRP, Al, ceramic, or others.

Optimal end-effector is selectable according to the carrying object and line layout.

Robot Arm Model	GCR4280-300-AM
Handled Object	SEMI standard up to 12 inches silicon wafer
Wafer Holding Method	By vacuum suction
Mechanical Structure	4-axis horizontal and multi-joint type
Motor	AC servo motor
Operating Range	From the robot center to the wafer center: 953mm Rotation angle (θ axis): 335 deg Vertical Stroke (Z-axis): 300mm
Transfer Speed	Arm (R-axis): 833mm/1.3sec Rotation (θ axis): 335deg/1.2sec Vertical Stroke (Z-axis): 300mm /sec
Repeatability	Within ±0.1mm
Cleanliness	ISO Class 2 (at wafer transfer level when exhausting driving part)
Facility Requirements	Power supply: Single-phase AC200V ±10% 2kVA Vacuum requirement: -53kPa or higher (vacuum-type end effector)
Controller Model	C5000S Series
Interface	RS232C and parallel photo I/O

＊Example of standard specifications with JEL standard end-effector (vacuum type)

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